| |||
| 可控熔塌高度芯片连接网格焊球阵列封装; 可控熔塌高度芯片连接球栅阵列封装 | |||
|
controlled collapse chip connection ball grid array package : 3 phrases, 1 sujets |
| Électronique | 3 |
| |||
| 可控熔塌高度芯片连接网格焊球阵列封装; 可控熔塌高度芯片连接球栅阵列封装 | |||
|
controlled collapse chip connection ball grid array package : 3 phrases, 1 sujets |
| Électronique | 3 |